EU Funding Programme

Cost-effective novel architectures of interconnects

The interconnect solution developed in this project should include the bi-polar plate itself together with the protective coating and the contacting materials to make the junction between cells. The development should make use of novel 3D contact Materials and manufacturing solutions that are flexible in use and could be adapted to any manufacturer’s planar stack design, as well as being adaptable to mass-manufacturing processes. Some of the expected impacts are improved contacting, flow distribution and interface stability which will lead to radically better performing interconnects, and thus SOC stack performance and durability. This should lead to a demonstrated increase in stack lifetime in representative operating conditions, allowing service that is more reliable to the end user.